複合電解銅箔

Composite Electrodeposited Copper Foil

由電解銅箔與高溫高絕緣薄膜經過F級絕緣膠液複合而成。為防止氧化，導電麵進 行 了鍍鈦。複合銅箱厚度為 45 μm ( 0. 045mm )，55μm ( 0. 055mm )，60μm( 0. 06mm )，同比之下是目前市場上銅塑複合帶的1/3 — 1/4重。

It is composited with electrolytic copper foil and high-temperature high insulation film by F grade insulation glue. To prevent oxidation, it has Titanium coating in conductive surface. Composite copper foil thickness: 45 μm ( 0.045mm )，55 μm ( 0. 055mm )，60 μm ( 0. 06mm )，it is 1/3—1/4 of the copper polyester composite tape in the market, very cost effective.